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28.03.2024 11:53:01
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Portfolio laptopów ThinkPad inspiruje pr
DPI 750E
 
RS Components oferuje szereg ulepszonych
conga-TR4
 
Komputer modułowy COM Express firmy cong
BHI260AB
 
An All-in-One Programmable Smart Sensor
SMI200
 
Nowe spojrzenie na klasykę: Kompaktowy i
BAHCO
 
Zestaw izolowanych kluczy BAHCO
s-Sense
 
Moduły s-Sense firmy R&D SOFTWARE SOLUTI
TH381
 
Miniaturowe, szczelne złączki serii TH38

Komponenty elektroniczne



Power Integrations’ GaN Technology Increases Output Power of High-Efficiency Display PSUs to 75 W
Power Integrations announced that its InnoSwitch™3-MX isolated switcher IC family has been expanded with the addition of three new PowiGaN™ devices. As part of a chipset with Power Integrations’ InnoMux™ controller IC, the new switcher ICs now support display and appliance power supply applications with a continuous output power of up to 75 W without a heatsink.

AMD Expands 3rd Gen AMD Ryzen™ Desktop Processor Family, Unleashing Powerful “Zen 2” Core For The Mainstream
AMD announced the newest additions to the 3rd Gen AMD Ryzen desktop processor family, the AMD Ryzen™ 3 3100 and AMD Ryzen™ 3 3300X processors and AMD B550 Chipset for Socket AM4 designed for 3rd Gen AMD Ryzen desktop processors with over 60 designs in development.

Infineon – CIPOS™ Mini IM564-X6D
The IM564-X6D is a new 20 A CIPOS™ Mini PFC-integrated IPM that combines a single boost PFC and three-phase inverter in one package. The PFC integration into inverter IPM helps to reduce significant PCB area and simplify manufacturing process to reduce overall system cost.

Rugged enclosure for PIM testing in complex multi-band 4G and 5G networks
Foremost Electronics, the engineering-led Essex based importer and specialist distributor of electromechanical components, works closely with its global suppliers to provide bespoke solutions for its customers where standard products do not meet the needs of the end product.

New solar fuses offer higher amperage in a streamlined, single case design
Littelfuse announced today the expansion of its SPXI series in-line solar fuses to include 35 to 60 amperage models. Designed to integrate into in-line assemblies within a wire harness, these 1500 V DC solar fuses protect photovoltaic (PV) installations from overloads and short circuits to minimize damage to solar panels.

New DC-DC Converters Offer 50 Percent Smaller Footprint
Murata unveiled the MYW series from the MonoBK™ DC-DC converter family. The new point-of-load (POL) modules offer a 50-percent smaller footprint than competing solutions and set new standards in size, efficiency and performance.

Miniaturowe, szczelne złączki serii TH381
Miniaturowe złączki szczelne serii TH381 firmy TECHNO to wyjątkowe połączenie wielu korzyści. Wysoka szczelność (IP69K) oraz odporność na warunki środowiskowe pozwalają je stosować w wielu zewnętrznych aplikacjach, takich jak oświetlenie uliczne, budynków, fontann i billboardów.

AVX Ethertronics new LoRa Module ETH-LORA-M-AX-01
The Ethertronics® LoRa Module ETH-LORA-M-AX-01 is a SMT mounted radio module that operates in the unlicensed 868 MHz and 915 MHz bands.

Safety in cars: Infineon’s AURIX™ is the first embedded safety controller worldwide to be ASIL-D certified according to ISO 26262:2018

Szczelne przekaźniki firmy Hongfa Relay
Przekaźniki samochodowe o konfiguracji styków SPDT przeznaczone do montażu w podstawce. Cechują się odpornością na kurz oraz wilgoć. Wersja wyposażona jest w czułą cewkę 12VDC oraz rezystor tłumiący przepięcia. Styki pokryte są stopem AgSnO2 i mogą przewodzić prąd ciągły 30A (obciążenie rezystancyjne). Przekaźniki HONGFA RELAY pracują w temperaturze -40…+125°C.

Even greater number of mating cycles with the push-pull connector Y-Circ P with protection rating IP68
The waterproof T-series of the Y-Circ P push-pull circular connector family from Yamaichi Electronics has now been qualified for up to 5,000 mating cycles. In addition, the connectors are now available in size 09, 12, 15 and 18.

FLH Mini Sealed 2.50mm Connectors
Amphenol's FLH Series Mini Sealed 2.50mm pitch connectors provide a wire-to-wire IP67 sealing in mated conditions. Its compact and waterproof characteristics make it ideal for applications in rugged environments as well as industrial, lighting appliances, HVAC and smart home.

Król wśród modułów LTE kat. 4
Nowy Quectel EG25-G to moduł LTE kat. 4. Został on specjalnie zoptymalizowany dla zastosowań M2M i IoT. Jest globalnie kompatybilny z siecią 4G i dzięki zastosowaniu technologii 3GPP Rel. 11 LTE zapewnia prędkość transmisji 150 Mbps przy pobieraniu i 50 Mbps przy przesyłaniu danych. Moduł EG25-G jest dostępny na zamówienie.

Microchip Expands Silicon Carbide (SiC) Family of Power Electronics to Provide System Level Improvements in Efficiency, Size and Reliability
700, 1200 and 1700V SBD-based power modules maximize switching efficiency, reduce thermal rise and allow smaller system footprint

Power Integrations’ SCALE-iDriver for SiC MOSFETs Achieves AEC-Q100 Automotive Qualification
Compact and robust isolated SiC MOSFET driver incorporates active clamping and <2 µs short-circuit turn-off time

Protect Against Rootkit and Bootkit Malware in Systems that Boot from External SPI Flash Memory
Microchip’s new cryptographic MCU, custom firmware and provisioning service are designed to enable platforms to detect and stop malicious firmware prior to run time

Nexperia delivers first ESD protection device for USB4
TrEOS diodes fully support USB4TM standard; devices feature low clamping, low capacitance, low leakage and very robust

Power Integrations Expands Range of InnoSwitch3 ICs Incorporating Robust 750 V GaN Transistors
PowiGaN technology permits manufacture of 94% efficient power supplies suitable for regions with frequent brown-outs and line surges


Interesting video


GAMING, AKCESORIA KOMPUTEROWE I NIE TYLKO


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


PRZEMYSŁOWE PRZETWORNIKI CIŚNIENIA MARKI CYNERGY3

Firma tygodnia

BALLUFF


Spis firm


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


DANFOSS


MOXA


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.



Kalendarz
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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