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Nexperia establishes new Application Specific FET category to deliver optimized performance
‘ASFETs’ feature MOSFET parameters tailored for particular applications

Nexperia, the expert in essential semiconductors, has responded to industry’s demands to maximize performance by defining a new MOSFET product group. Application Specific FETs (ASFETs) feature MOSFETs with optimized parameters for specific applications. By focusing on individual applications, significant improvements can be offered.

Nexperia is offering ASFET families for battery isolation, motor control, hot-swap and Power over Ethernet (PoE) applications. Defining the improvements that these tailored ASFETs can offer is application specific, examples include, 3x – 5x improvement in Safe Operating Area (SOA) for hot-swap applications, and maximum current ratings in excess of 300 A for motor applications.

Commented Chris Boyce, Senior Director for the Power MOSFETs Group at Nexperia: “As designers push the boundaries of performance, it is crucial to understand how the MOSFET will be used in the application. There are 100+ parameters on a regular MOSFET datasheet but usually only a few are critical in each project.  However, as the applications change, so do the critical parameters. At Nexperia, we determine the performance of every element of our products; the core silicon technology, the chip design, the package and the manufacturing & test procedures. By keeping individual application requirements front & centre of our thinking, we can choose to optimise the parameters that matter most in a particular use-case, often at the expense of others of less relevance. In essence we have combined our proven MOSFET expertise with a broad understanding of applications so we can tailor products which offer the ultimate performance for a specific application or functionality.”

The ASFET category will be further enhanced with the imminent release of a new family of automotive products with guaranteed repetitive avalanche performance for driving inductive loads.

Added Boyce: “We are continually seeking to deepen our understanding of specific applications, often working hand-in-hand with our customers. In exposing our best engineers to detailed application requirements, we are opening new and exciting possibilities of innovation – there are many more ASFET advances in the pipeline.”

More details are available at: https://efficiencywins.nexperia.com/efficient-products/optimizing-mosfets-to-fit-specific-applications.html 

2020102102 / 21.10.2020 / Komponenty elektroniczne / NEXPERIA /

USB4 ESD devices from Nexperia provide optimum balance of protection and performance
TrEOS based protection offers industry-leading insertion and return loss to help meet tight system budgets

Nexperia launches new portfolio of application specific MOSFETs (ASFETs) for automotive airbags
Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and more reliable choice.

Nexperia establishes new Application Specific FET category to deliver optimized performance
‘ASFETs’ feature MOSFET parameters tailored for particular applications

Nexperia launches industry-first LED drivers in DFN package with side-wettable flanks
AEC-Q101-qualified DFN2020D-6 devices save up to 90% PCB space; side-wettable flanks enable automated inspection (AOI) and improve reliability

Nexperia launches Common Mode Filter with ESD protection for HDMI2.1 and DisplayPort
Nexperia, the expert in essential semiconductors, has announced its new PCMFxHDMI2BA-C, a combined, highly efficient, common mode filter and ESD protection device with the widest 10 GHz differential bandwidth. It is suitable for the latest HDMI 2.1 standard up to 12G FRL, where eye-diagram tests were passed even with “worst cable model”.

New automotive TrEOS ESD protection from Nexperia combines high signal integrity, low clamping voltage and high surge robustness
Industry-benchmark performance devices now AEC-Q101 qualified - protecting infotainment, multimedia and ADAS systems.

Nexperia launches ‘Power Live’ July 2nd & 3rd 2020
Nexperia, the expert in essential semiconductors, today announced ‘Power Live’ a virtual conference on the 2nd and 3rd of July which will cover a wide range of subjects related to power electronics including GaN devices, Silicon Germanium (SiGe) rectifiers, automotive applications and packaging technology.

Nexperia delivers widest range of AEC-Q101 discretes in miniature, leadless rugged DFN packages
Nexperia today announced the industry’s widest portfolio of automotive-qualified discretes in space-saving, thermally-efficient, AOI-compatible DFN (Discrete Flat No leads) packages. The AEC-Q101 range of devices available cuts across all Nexperia’s product groups and includes switching, Schottky, Zener and protection diodes, bipolar junction transistors (BJTs), N- and P-channel MOSFETs, resistor-equipped transistors and LED drivers.

Nexperia announces next generation 650 V Gallium Nitride (GaN) Technology
Next-gen GaN technology targets automotive, 5G and datacenter applications; Devices available packaged in TO-247 and innovative Copper Clip SMD

Silicon Germanium (SiGe) rectifiers from Nexperia combine cutting-edge high efficiency, thermal stability and space-savings
AEC-Q101 approved devices with 120 V, 150 V, and 200 V combine best attributes of Schottky and fast recovery diodes

Nexperia launches P-channel MOSFETs in robust, space-saving LFPAK56 package
Nexperia, the expert in essential semiconductors, has launched industry’s first family of P-channel MOSFETs in the robust, space-saving LFPAK56 (Power-SO8) package. AEC-Q101 qualified for automotive applications, the new devices are an ideal replacement for DPAK MOSFETs, offering a reduction in footprint of over 50% whilst maintaining high performance levels. The new products are available in 30 V – 60 V, with RDS(on) down to 10 mΩ (30 V)

Ultra-tiny MOSFETs from Nexperia are 36% smaller with lowest RDS(on)
Nexperia has launched a range of MOSFETs in the ultra-small DFN0606 package for mobile and portable applications including wearables. The devices also offer the lowest RDS(on) for their size and employ the commonly used pitch of 0.35 mm to simplify PCB assembly processes.

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