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22.11.2024 11:28:08
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Galaxy A16 – nowy budżetowy smartfon w r
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PROGRAMOWALNY ZASILACZ LABORATORYJNY MAN
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Portfolio laptopów ThinkPad inspiruje pr
DPI 750E
 
RS Components oferuje szereg ulepszonych
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Komputer modułowy COM Express firmy cong
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Nowe spojrzenie na klasykę: Kompaktowy i
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Zestaw izolowanych kluczy BAHCO
s-Sense
 
Moduły s-Sense firmy R&D SOFTWARE SOLUTI
Komponenty elektroniczne


Inductors: Compact dual inductors with high saturation current
TDK Corporation has extended its range of dual inductors to include the new EPCOS series B82477D6*. The seven series types cover an inductance range from 2 x 3.9 µH to 2 x 47 µH and are designed for maximum rated currents from 2.83 A to 7.05 A. A special feature of the inductors, which are certified according to AEC-Q200 and compatible with RoHS, are the high saturation currents of up to 16.1 A.
10th Gen Intel Core H-series Introduces the World’s Fastest Mobile Processor at 5.3 GHz
What’s New: Today, Intel breaks beyond the 5 GHz barrier for laptops with the launch of the 10th Gen Intel® Core™ H-series mobile processors. Headlined by the 10th Gen Intel Core i9-10980HK1 processor, the H-series delivers desktop-caliber performance that gamers and creators can take anywhere.
DINKLE BUS Housingsystem
In addition to the extremely compact housing widths of 12mm and 20mm DINKLE is now offering 40mm and 60mm versions for additional electronics installation space. The new standard widths offer sufficient space to accommodate capacitors, relays or other high electronic components on the PCB.
Ultra-tiny MOSFETs from Nexperia are 36% smaller with lowest RDS(on)
Nexperia has launched a range of MOSFETs in the ultra-small DFN0606 package for mobile and portable applications including wearables. The devices also offer the lowest RDS(on) for their size and employ the commonly used pitch of 0.35 mm to simplify PCB assembly processes.
An All-in-One Programmable Smart Sensor for Always-On Applications
For all those high-tech applications such as fitness tracking, step counting, indoor navigation and gesture recognition on your smart watch, smartphone or other mobile devices, all require ultra-low power, high performance smart sensors.
Power Integrations’ GaN Technology Increases Output Power of High-Efficiency Display PSUs to 75 W
Power Integrations announced that its InnoSwitch™3-MX isolated switcher IC family has been expanded with the addition of three new PowiGaN™ devices. As part of a chipset with Power Integrations’ InnoMux™ controller IC, the new switcher ICs now support display and appliance power supply applications with a continuous output power of up to 75 W without a heatsink.
AMD Expands 3rd Gen AMD Ryzen™ Desktop Processor Family, Unleashing Powerful “Zen 2” Core For The Mainstream
AMD announced the newest additions to the 3rd Gen AMD Ryzen desktop processor family, the AMD Ryzen™ 3 3100 and AMD Ryzen™ 3 3300X processors and AMD B550 Chipset for Socket AM4 designed for 3rd Gen AMD Ryzen desktop processors with over 60 designs in development.
Infineon – CIPOS™ Mini IM564-X6D
The IM564-X6D is a new 20 A CIPOS™ Mini PFC-integrated IPM that combines a single boost PFC and three-phase inverter in one package. The PFC integration into inverter IPM helps to reduce significant PCB area and simplify manufacturing process to reduce overall system cost.
Rugged enclosure for PIM testing in complex multi-band 4G and 5G networks
Foremost Electronics, the engineering-led Essex based importer and specialist distributor of electromechanical components, works closely with its global suppliers to provide bespoke solutions for its customers where standard products do not meet the needs of the end product.
New solar fuses offer higher amperage in a streamlined, single case design
Littelfuse announced today the expansion of its SPXI series in-line solar fuses to include 35 to 60 amperage models. Designed to integrate into in-line assemblies within a wire harness, these 1500 V DC solar fuses protect photovoltaic (PV) installations from overloads and short circuits to minimize damage to solar panels.
New DC-DC Converters Offer 50 Percent Smaller Footprint
Murata unveiled the MYW series from the MonoBK™ DC-DC converter family. The new point-of-load (POL) modules offer a 50-percent smaller footprint than competing solutions and set new standards in size, efficiency and performance.
Miniaturowe, szczelne złączki serii TH381
Miniaturowe złączki szczelne serii TH381 firmy TECHNO to wyjątkowe połączenie wielu korzyści. Wysoka szczelność (IP69K) oraz odporność na warunki środowiskowe pozwalają je stosować w wielu zewnętrznych aplikacjach, takich jak oświetlenie uliczne, budynków, fontann i billboardów.
AVX Ethertronics new LoRa Module ETH-LORA-M-AX-01
The Ethertronics® LoRa Module ETH-LORA-M-AX-01 is a SMT mounted radio module that operates in the unlicensed 868 MHz and 915 MHz bands.
Safety in cars: Infineon’s AURIX™ is the first embedded safety controller worldwide to be ASIL-D certified according to ISO 26262:2018
Szczelne przekaźniki firmy Hongfa Relay
Przekaźniki samochodowe o konfiguracji styków SPDT przeznaczone do montażu w podstawce. Cechują się odpornością na kurz oraz wilgoć. Wersja wyposażona jest w czułą cewkę 12VDC oraz rezystor tłumiący przepięcia. Styki pokryte są stopem AgSnO2 i mogą przewodzić prąd ciągły 30A (obciążenie rezystancyjne). Przekaźniki HONGFA RELAY pracują w temperaturze -40…+125°C.
FLH Mini Sealed 2.50mm Connectors
Amphenol's FLH Series Mini Sealed 2.50mm pitch connectors provide a wire-to-wire IP67 sealing in mated conditions. Its compact and waterproof characteristics make it ideal for applications in rugged environments as well as industrial, lighting appliances, HVAC and smart home.
Even greater number of mating cycles with the push-pull connector Y-Circ P with protection rating IP68
The waterproof T-series of the Y-Circ P push-pull circular connector family from Yamaichi Electronics has now been qualified for up to 5,000 mating cycles. In addition, the connectors are now available in size 09, 12, 15 and 18.
Król wśród modułów LTE kat. 4
Nowy Quectel EG25-G to moduł LTE kat. 4. Został on specjalnie zoptymalizowany dla zastosowań M2M i IoT. Jest globalnie kompatybilny z siecią 4G i dzięki zastosowaniu technologii 3GPP Rel. 11 LTE zapewnia prędkość transmisji 150 Mbps przy pobieraniu i 50 Mbps przy przesyłaniu danych. Moduł EG25-G jest dostępny na zamówienie.
Interesting video


electronica—Leading the way to the All Electric Society


GAMING, AKCESORIA KOMPUTEROWE I NIE TYLKO


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022

Firma tygodnia

MikroElektronika d.o.o.


Spis firm


MikroElektronika d.o.o.

PULSIV


Panasonic Industry

Cambridge GaN Devices


Traco Power

BALLUFF


Seica

PEI-Genesis


KEYENCE

CML Microcircuits


SAMTEC

ams-OSRAM


INTEL

TDK Corporation


Giada

RS group


NOKIA

ANRITSU


Digi-Key Electronics

AERS


Flex Power Modules

Danisense


BINDER

Parker Hannifin


DANFOSS

MOXA


Alliance Memory

Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH

Antenova Ltd


Kalendarz
intersec Dubai 2025, 14.-16.1.2025
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
AMPER 2025, Brno, CZ, 18.-20.3.2025

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara

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