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Seica
 

PEI-Genesis
 

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SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation
 

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Galaxy A16
 
Galaxy A16 – nowy budżetowy smartfon w r
POLOLU-4980
 
MINIATUROWE PRZETWORNICE STEP-UP/STEP-DO
MANSON SDP-2210
 
PROGRAMOWALNY ZASILACZ LABORATORYJNY MAN
ThinkPad Laptop
 
Portfolio laptopów ThinkPad inspiruje pr
DPI 750E
 
RS Components oferuje szereg ulepszonych
conga-TR4
 
Komputer modułowy COM Express firmy cong
BHI260AB
 
An All-in-One Programmable Smart Sensor
SMI200
 
Nowe spojrzenie na klasykę: Kompaktowy i
BAHCO
 
Zestaw izolowanych kluczy BAHCO
s-Sense
 
Moduły s-Sense firmy R&D SOFTWARE SOLUTI
Komponenty elektroniczne


Microchip Expands Silicon Carbide (SiC) Family of Power Electronics to Provide System Level Improvements in Efficiency, Size and Reliability
700, 1200 and 1700V SBD-based power modules maximize switching efficiency, reduce thermal rise and allow smaller system footprint
Power Integrations’ SCALE-iDriver for SiC MOSFETs Achieves AEC-Q100 Automotive Qualification
Compact and robust isolated SiC MOSFET driver incorporates active clamping and <2 µs short-circuit turn-off time
Protect Against Rootkit and Bootkit Malware in Systems that Boot from External SPI Flash Memory
Microchip’s new cryptographic MCU, custom firmware and provisioning service are designed to enable platforms to detect and stop malicious firmware prior to run time
Nexperia delivers first ESD protection device for USB4
TrEOS diodes fully support USB4TM standard; devices feature low clamping, low capacitance, low leakage and very robust
Power Integrations Expands Range of InnoSwitch3 ICs Incorporating Robust 750 V GaN Transistors
PowiGaN technology permits manufacture of 94% efficient power supplies suitable for regions with frequent brown-outs and line surges
7 Kolorów listew zaciskowych
Zielony, szary, czarny, niebieski, czerwony, żółty i pomarańczowy - dzięki kolorowym listwom zaciskowym Euroclamp, możliwość nieprawidłowego podłączenia przewodów jest ograniczona do minimum.
Aluminum electrolytic capacitors: Compact design with high ripple current capability
TDK Corporation (TSE:6762) presents the new B43707* and B43727* series of EPCOS aluminum electrolytic capacitors with screw terminals. They are designed for rated voltages of between 400 V DC and 450 V DC and cover a capacitance range from 1800 µF to 18,000 µF.
Złączki przemysłowe o wytrzymałej konstrukcji – szersza gama kolorystyczna, korzystniejsza cena
Złączki serii CA posiadają wzmocnioną obudowę plastikową, dzięki czemu stanowią wysokiej jakości, wydajną alternatywę dla złączek w obudowie metalowej. Są niezawodne nawet w trudnych warunkach pracy przy wysokiej wilgotności i dużym zapyleniu. Poza tym są zawsze łatwe do podłączenia i instalacji. Praktyczna gama kolorystyczna ułatwia montaż i konserwację.
Vishay Intertechnology AEC-Q200 Qualified Thick Film High Power Resistors Reduce Component Counts, Lower Costs
Designed for Direct Mounting on a Heatsink, Devices Offer Rated Power to 800 W and Pulse Handling Capability to 1500 J
Infineon – IHV-B 3.3 kV single switch module FZ2000R33HE4 and FZ1400R33HE4
The well-known IHV-B 3.3 kV single switch IGBT module has been improved heavily to meet current and future requirements for traction and industry applications such as Medium Voltage Drives or HVDC.
Coin-Cell-Supercaps by EATON
EATON offers a wide selection of coin-cell-super-capacitors in various mechanical versions. Due to the current market situation, we advise to implement new designs or approvals quickly and to secure production capacities.
W jaki sposób działa filtr EMC?
Szwajcarska firma Schurter oferuje filtry EMC, dławiki sygnału współbieżnego oraz filtry ze zintegrowanym wlotem mocy, przełącznikiem i bezpiecznikiem. Typowy filtr EMC zawiera dławiki sygnału współbieżnego oraz kondensatory klasy X i Y. Ale jak to działa?
New PIC® MCU Family Moves Software Tasks to Hardware for Faster System Response
Microchip’s PIC18-Q43 family combines more Core Independent Peripherals and an extensive development tool ecosystem for improved designs in real-time control and connected applications
Ultra-Low Power and Security for IoT Come First on New STM32L5 Microcontrollers from STMicroelectronics
STMicroelectronics announces ultra-low-power STM32L5x2 microcontrollers (MCUs) that emphasize security to assure better protected IoT-connected applications.
TI's EMI-optimized integrated transformer technology miniaturizes isolated power transfer into IC-sized packaging
Engineers can shrink their power solution by as much as 80% and maximize efficiency in high-voltage industrial applications with a new high-density, isolated DC/DC bias power supply
Advantech Releases NXP i.MX8 QuadMax ROM-7720, Qseven Module for AI and Machine Vision Application
Advantech is pleased to announce its first NXP i.MX8 product: ROM-7720, an Arm-based Qseven module powered by the NXP Arm® CortexTM-A72 i.MX8 high-performance processor. ROM-7720 supports 4K resolution via HDMI 2.0 with H.265 H264 hardware accelerator engines for video decoding and additional GPU for image processing. Using OpenVX, it is ideal for AI, machine vision, and big data processing and analytics applications in the IoT era.
Next-Generation Miniaturized Rubidium Atomic Clock Improves Performance and adds Features without Increasing Size
Microchip releases MAC-SA5X, enhancing its Miniature Atomic Clock (MAC) technology to deliver wider temperature range and rapid warm-up time
ON Semiconductor Launches Automotive LED Drivers and Controllers for Advanced Vehicle Lighting Applications
New family of devices simplifies task of designing efficient and reliable lighting solutions with sophisticated functionality to enhance road safety
Interesting video


electronica—Leading the way to the All Electric Society


GAMING, AKCESORIA KOMPUTEROWE I NIE TYLKO


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022

Firma tygodnia

MikroElektronika d.o.o.


Spis firm


MikroElektronika d.o.o.

PULSIV


Panasonic Industry

Cambridge GaN Devices


Traco Power

BALLUFF


Seica

PEI-Genesis


KEYENCE

CML Microcircuits


SAMTEC

ams-OSRAM


INTEL

TDK Corporation


Giada

RS group


NOKIA

ANRITSU


Digi-Key Electronics

AERS


Flex Power Modules

Danisense


BINDER

Parker Hannifin


DANFOSS

MOXA


Alliance Memory

Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH

Antenova Ltd


Kalendarz
intersec Dubai 2025, 14.-16.1.2025
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
AMPER 2025, Brno, CZ, 18.-20.3.2025

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara

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