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Nexperia delivers widest range of AEC-Q101 discretes in miniature, leadless rugged DFN packages
Nexperia today announced the industry’s widest portfolio of automotive-qualified discretes in space-saving, thermally-efficient, AOI-compatible DFN (Discrete Flat No leads) packages. The AEC-Q101 range of devices available cuts across all Nexperia’s product groups and includes switching, Schottky, Zener and protection diodes, bipolar junction transistors (BJTs), N- and P-channel MOSFETs, resistor-equipped transistors and LED drivers.

Automotive qualified discrete leadless packages offered by Nexperia range from the very small form factor DFN1006BD-2 (1 x 0.6 x 0.5 mm) up to DFN2020D-3 (2 x 2 x 0.65 mm), including the recently-released DFN1110D-3 and DFN1412D-3 styles. DFN devices can measure as small as 0.6 mm2 offering a PCB space-saving of up to 90 % when compared to current SOT23 devices. The excellent thermal performance (Rth(j-sp)) allows an equal or better Ptot on the smaller DFN footprint. At the same time these packages stay cooler and improve overall system reliability. The Nexperia DFN package technology supports a Tj capability of up to 175°C.

Because automated optical inspection (AOI) is vital for some applications – especially automotive - Nexperia pioneered the development of side-wettable flanks (SWF) for the DFN package in 2010 and devices with SWF are now a proven, accepted solution. This enables visible solder joints to be inspected post soldering. An additional benefit of DFN packages with SWF comes from the mechanical robustness of the bond to the PCB, which is better than devices without side-wettable flanks. SWF improve shear forces and board bending capabilities.

Mark Roeloffzen, Vice President & General Manager of Nexperia’s Bipolar Discretes Business Group comments: “With the automotive DFN package family Nexperia gives engineers the choice: either to develop their application with current leaded SMD packages or in the space saving DFN technology. We are dedicated to lead the market with package innovation serving customer needs and offering the broadest discrete portfolio in DFN technology.”

A large number of discrete semiconductors in DFN packages is already in volume production, and Nexperia will release many more throughout 2020, resulting in the industry’s widest portfolio of such devices. Types available include standard, high-runner products such as BC847, BC817 and BAV99, plus many more.

More information on the new AEC-Q101-qualified portfolio of DFN-packaged discretes with SWF - including product specs and datasheets - is available at www.nexperia.com/automotiveDFN.

2020062301 / 23.06.2020 / Komponenty elektroniczne / NEXPERIA /

USB4 ESD devices from Nexperia provide optimum balance of protection and performance
TrEOS based protection offers industry-leading insertion and return loss to help meet tight system budgets

Nexperia launches new portfolio of application specific MOSFETs (ASFETs) for automotive airbags
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Nexperia establishes new Application Specific FET category to deliver optimized performance
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Nexperia launches industry-first LED drivers in DFN package with side-wettable flanks
AEC-Q101-qualified DFN2020D-6 devices save up to 90% PCB space; side-wettable flanks enable automated inspection (AOI) and improve reliability

Nexperia launches Common Mode Filter with ESD protection for HDMI2.1 and DisplayPort
Nexperia, the expert in essential semiconductors, has announced its new PCMFxHDMI2BA-C, a combined, highly efficient, common mode filter and ESD protection device with the widest 10 GHz differential bandwidth. It is suitable for the latest HDMI 2.1 standard up to 12G FRL, where eye-diagram tests were passed even with “worst cable model”.

New automotive TrEOS ESD protection from Nexperia combines high signal integrity, low clamping voltage and high surge robustness
Industry-benchmark performance devices now AEC-Q101 qualified - protecting infotainment, multimedia and ADAS systems.

Nexperia launches ‘Power Live’ July 2nd & 3rd 2020
Nexperia, the expert in essential semiconductors, today announced ‘Power Live’ a virtual conference on the 2nd and 3rd of July which will cover a wide range of subjects related to power electronics including GaN devices, Silicon Germanium (SiGe) rectifiers, automotive applications and packaging technology.

Nexperia delivers widest range of AEC-Q101 discretes in miniature, leadless rugged DFN packages
Nexperia today announced the industry’s widest portfolio of automotive-qualified discretes in space-saving, thermally-efficient, AOI-compatible DFN (Discrete Flat No leads) packages. The AEC-Q101 range of devices available cuts across all Nexperia’s product groups and includes switching, Schottky, Zener and protection diodes, bipolar junction transistors (BJTs), N- and P-channel MOSFETs, resistor-equipped transistors and LED drivers.

Nexperia announces next generation 650 V Gallium Nitride (GaN) Technology
Next-gen GaN technology targets automotive, 5G and datacenter applications; Devices available packaged in TO-247 and innovative Copper Clip SMD

Silicon Germanium (SiGe) rectifiers from Nexperia combine cutting-edge high efficiency, thermal stability and space-savings
AEC-Q101 approved devices with 120 V, 150 V, and 200 V combine best attributes of Schottky and fast recovery diodes

Nexperia launches P-channel MOSFETs in robust, space-saving LFPAK56 package
Nexperia, the expert in essential semiconductors, has launched industry’s first family of P-channel MOSFETs in the robust, space-saving LFPAK56 (Power-SO8) package. AEC-Q101 qualified for automotive applications, the new devices are an ideal replacement for DPAK MOSFETs, offering a reduction in footprint of over 50% whilst maintaining high performance levels. The new products are available in 30 V – 60 V, with RDS(on) down to 10 mΩ (30 V)

Ultra-tiny MOSFETs from Nexperia are 36% smaller with lowest RDS(on)
Nexperia has launched a range of MOSFETs in the ultra-small DFN0606 package for mobile and portable applications including wearables. The devices also offer the lowest RDS(on) for their size and employ the commonly used pitch of 0.35 mm to simplify PCB assembly processes.

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